Our Tools

Tools of the Trade

Black Forest Engineering takes great care in choosing the tools that aid design and verification.  These tools must stay current with advances in modeling and manufacturing as well as support the packages provided by the foundries.  As our customers’ needs and the requirements of our industry evolve, we continually evaluate all that is critical for us to ensure function, performance, viability and yield for each design we create.

Tools-icon

Design and Simulation

Layout & Physical Verification

 

Employment Opportunities

Working

A Career with BFE

BFE continuously looks for engineering talent that could complement our already diversely competent and experienced group of designers.  Every engineer at Black Forest Engineering must have a solid grasp of fundamental properties and design concepts.  BFE engineers must also have the creativity to come up with the simplest and most easily implemented solution, providing for successful and robust designs.

To inquire about our position(s) please email us @

employment@bfe.com
 
 

BFE is an equal opportunity employer. All applicants will be considered for employment without regard to race, color, ancestry, national origin, sex, gender, sexual orientation, marital status, religion, age, disability, gender identity, results of genetic testing, service in the military, or any other characteristic protected by applicable federal, state or local laws. We will make a reasonable accommodation for any qualified applicant with a disability, provided that the individual is otherwise qualified to safely perform the essential functions of the job with or without accommodation and that the accommodation would not impose an undue hardship on the operation of our business. Please let us know if you believe you require reasonable accommodation, or if you would like assistance to complete an application or to participate in an interview at the company.

Visit our Office

Visiting our Office

If you are coming to our office be sure to experience some of the wonderful things that Colorado Springs has to offer.  In case they could be useful we have compiled our own directions for common landmarks here.

Places to Stay …

 
BFE-Office-with-PikesPeak-sq

Things to do …

 
 

Experience

Decades of Experience

i >350 fully custom ICs

b Over 30 years of experience

jOver 15 different silicon foundries

cProcess experience ranging 60nm-1.2um

pInfrared camera development

fTest system development

BFE's design cycle from initial request to finished application solution
 

kApplications

  • IR detectors / preamplifiers / multiplexers
  • LIDAR detectors & readout
  • Laser drivers
  • Photonic counting circuits
  • Micro-power A/D and D/A converters
  • X-ray and high energy particle detectors and interface chips
  • Radiation hard versions of above
  • Image sensors (CMOS and CCD)
  • Image processors
  • Integrated liquid crystal drivers

bChip Size Extremes

  • 300um diameter die size imagers for medical applications
  • 17×19 mm2 display driver for projection displays
  • 51×25 mm2 visible/scintillator x-ray sensor (using stitching)

gSpecial Features

  • 2Ghz analog bandwidth CMOS for LIDAR range sensing
  • Single photon detection
  • 22V CMOS devices
  • Far infrared & high energy particle readout processors
  • SWIR, MWIR, LWIR

hNon-Standard processes

Unique & cutting edge applications often require specific technologies

  •  Thermopile – Micrel
  •  PiN detector – Micron Semiconductor Ltd.
  •  Rad-hard CMOS – Honeywell 0.8 SOI
  • IR Detectors – InGaAs, HgCdTe, PbSe, a-Si
  •  CCD – Supertex 1.2um

jFoundry Experience

  • TSMC 0.13um, 0.18um, 0.25um, 0.35um (includes their BCD [Bipolar, CMOS, DMOS] Power management technology)
  • Tower/Jazz 0.13um, 0.18um, 0.25um, 0.35um (Stitching, ITAR Compliant)
  • IBM (corp. site) 0.13um (ITAR Compliant)
  • Austria MicroSystems 0.35um
  • Others include: AMIS (0.5um, 1.2um), CSMC (0.6um), Fujitsu (0.25um), HP (0.35um, 0.5um), Amkor (0.35um, 0.5um), Texas Instruments (0.8um, 1um), UMC (0.4um (5V))

jMask Types

  • Full Mask Sets
  • Stitching: Enables fabrication of large dice.  A repeated exposure masking process that has its own complexities yield considerations.
  • MPW: In addition to foundry specific multi-project wafer  runs we have worked with MOSISGlobal UnichipEUROPRACTICE.

hProcess Types & Materials

  • CMOS
  • CMOS/CCD
  • Bi-CMOS
  • BCD (Bipolar, CMOS, DMOS)
  • CMOS-SOS

dDevice Protocols/Interfaces

  • SERDES
  • USB
  • SPI
  • LVDS

fCustom Test Systems

Performance built for your specific requirements.

  • Wafer probing
  • Testing at cryogenic temperatures
  • PCB designs and interfaces using FPGA, CPLD and a variety of other components
  • Solutions for system interface problems:
    • High density interconnect
    • Non-standard packaging
    • Optics