Decades of Experience

i >350 fully custom ICs

b Over 30 years of experience

jOver 15 different silicon foundries

cProcess experience ranging 60nm-1.2um

pInfrared camera development

fTest system development

BFE's design cycle from initial request to finished application solution


  • IR detectors / preamplifiers / multiplexers
  • LIDAR detectors & readout
  • Laser drivers
  • Photonic counting circuits
  • Micro-power A/D and D/A converters
  • X-ray and high energy particle detectors and interface chips
  • Radiation hard versions of above
  • Image sensors (CMOS and CCD)
  • Image processors
  • Integrated liquid crystal drivers

bChip Size Extremes

  • 300um diameter die size imagers for medical applications
  • 17×19 mm2 display driver for projection displays
  • 51×25 mm2 visible/scintillator x-ray sensor (using stitching)

gSpecial Features

  • 2Ghz analog bandwidth CMOS for LIDAR range sensing
  • Single photon detection
  • 22V CMOS devices
  • Far infrared & high energy particle readout processors

hNon-Standard processes

Unique & cutting edge applications often require specific technologies

  •  Thermopile – Micrel
  •  PiN detector – Micron Semiconductor Ltd.
  •  Rad-hard CMOS – Honeywell 0.8 SOI
  • IR Detectors – InGaAs, HgCdTe, PbSe, a-Si
  •  CCD – Supertex 1.2um

jFoundry Experience

  • TSMC 0.13um, 0.18um, 0.25um, 0.35um (includes their BCD [Bipolar, CMOS, DMOS] Power management technology)
  • Tower/Jazz 0.13um, 0.18um, 0.25um, 0.35um (Stitching, ITAR Compliant)
  • IBM (corp. site) 0.13um (ITAR Compliant)
  • Austria MicroSystems 0.35um
  • Others include: AMIS (0.5um, 1.2um), CSMC (0.6um), Fujitsu (0.25um), HP (0.35um, 0.5um), Amkor (0.35um, 0.5um), Texas Instruments (0.8um, 1um), UMC (0.4um (5V))

jMask Types

  • Full Mask Sets
  • Stitching: Enables fabrication of large dice.  A repeated exposure masking process that has its own complexities yield considerations.
  • MPW: In addition to foundry specific multi-project wafer  runs we have worked with MOSISGlobal UnichipEUROPRACTICE.

hProcess Types & Materials

  • CMOS
  • Bi-CMOS
  • BCD (Bipolar, CMOS, DMOS)

dDevice Protocols/Interfaces

  • USB
  • SPI
  • LVDS

fCustom Test Systems

Performance built for your specific requirements.

  • Wafer probing
  • Testing at cryogenic temperatures
  • PCB designs and interfaces using FPGA, CPLD and a variety of other components
  • Solutions for system interface problems:
    • High density interconnect
    • Non-standard packaging
    • Optics