From Spec to System

>260 fully custom ICs

Die Sizes from 300um wide to 51x25mm

Over 15 different silicon foundries

Process experience ranging 60nm-1.2um


Primary Services

As a full service custom mixed-signal ASIC design house, Black Forest Engineering helps customers of all sizes with everything from the initial IC specification all the way to providing a functional test system.

  • We help ensure that the specification is complete and meets your system’s requirements.
  • We can help select the optimal foundry and process for manufacturing the ICs.
  • We manage the manufacturing and packaging logistics.
  • We test the ICs to ensure that they meet spec.

Additional Services

  • We can design specific blocks for use in existing or other designs
  • we are available to consult on existing projects offering our expertise to guide design decisions.

Experience in special applications

  • IR detectors / preamplifers / multiplexers
  • Micro-power A/D and D/A converters
  • X-ray and high energy particle detectors and interface chips
  • Radiation hard versions of above
  • Image sensors (CMOS and CCD)
  • Image processors
  • Integrated liquid crystal drivers

Chip Size Extremes

  • 300um diameter die size imagers for medical applications
  • 17×19 mm2 display driver for projection displays
  • 51×25 mm2 visible/scintillator x-ray sensor (using stiching)

Speeds and Signals

  • as high speed as 2Ghz analog bandwidth CMOS for LADAR range sensing
  • down to single photon detection
  • from far infrared to high energy particle readout processors

Non-Standard processes for special applications:

  •  Thermopile – Micrel
  •  PiN detector – Micron Semiconductor Ltd.
  •  Rad-hard CMOS – Honeywell 0.8 SOI
  •  CCD – Supertex 1.2um

Multi-Project Wafer (MPW) runs for prototyping

We have extensive experience with MPW’s for cost effective prototyping. note: Some foundries like TSMC provide their own MPW service as well.

Experience with a variety of Process Types

  • CMOS
  • Bi-CMOS

Device Interfaces

  • on-chip analog, digital, and instruction based interfaces
  • PCB designs and interfaces using FPGA, CPLD, and micro-processor, and analog/digital components

Custom Testing and System Interface

Performance built for your specific requirements.
  • Testing the proper parameters for your application –  prototype to small volume production
  • Wafer probing and testing at cryogenic temperatures available
  • Solutions for system interface problems:
    • Interface electronics
    • High density interconnect
    • Special packaging
    • Optics